Method of accommodating electronic component in casing

摘要

A method of accommodating an electronic component in a casing, comprising the steps of: forming the casing by a pair of first and second casings made of thermoplastic resin; providing a terminal frame having a substrate portion, a plurality of lead terminals and at least two electrically conductive terminals; securing the electronic component to the substrate portion or integrally forming the electronic component with the substrate portion; interposing the substrate portion between the first and second casings; and establishing electrical conduction between the electrically conductive terminals so as to heat the substrate portion such that the first and second casings are attached to each other through melting thereof.