| 摘要 |
PURPOSE:To make the connecting precesses to connect two wires of lead wires to each semiconductor element in one continuous process and to enable to upgrade the productivity of a rectifying element by a method wherein the angle, which is formed by the direction of the P-N junction surface of the semiconductor element to constitute the rectifying element and the stretched out direction of the parts of the lead wires, which are buried in the insulator layer, is specified. CONSTITUTION:Lead wires 15 and 16 are delivered in parallel to each other and continuously from rollers 21 and 22 and head parts 15a and 16b are formed. Solder layers 13 and 14 are adhered to the head parts 15a and 16b and both of the head parts 15a and 16b and the solder layers 13 and 14 are junctioned by heat holding a semiconductor element 12 between both. At this time, the angle theta, which is formed by the direction A of the P-N junction 11 of the semiconductor 12 and the stretched direction B of the lead wires 15 and 16, is set within an extent of 0 deg.<=theta<=50 deg.. The process ranging from the abovementioned first process to this process is one continuous process and a block consisting of plural pieces of the semiconductor elements 12 connected to the two wires of long lead wires in a chain form is formed. After that, the surface of each element 12 is coated with a polyimide resin, for example, for being used as a protective layer 17 and after the whole is sealed with an epoxy resin layer 18, for example, the lead wires 15 and 16 are respectively cut at the prescribed place, and each semiconductor element 12 is used as an element to constitute an individual rectifying element 10. |
