Method of hermetically sealing electronic packages

摘要

Electronic packages and the like, particularly finished packages with leaky welds, are hermetically sealed by vapor deposition of a polymer film through a sealable port. A high quality film is obtained by slow deposition of a monomer vapor which subsequently polymerizes. The process is not destructive due to the lack of high temperatures and curing agents. Extremely low permeability for common molecules and for water vapor is achieved by utilizing C-type para-xylylene as the polymer material.