发明名称 |
ELECTRONIC COMPONENT CAP AND SEAL |
摘要 |
<p>ELECTRONIC COMPONENT CAP AND SEAL Aik Tho (Simon) Chee Wee Soon Kiat A cap and seal including a central cap (20) to be positioned over an electronic component such as an integrated circuit chip (12), has a spaced upstanding wall or dam (22) which may be staked to the circuit board in assembly forming with the peripheral side wall (21) of the cap a channel or moat (19). Bridging means (24) extend between wall (21) and wall (22) onto which is placed a preform ring (30) of solid sealant material. Heating of the assembly, more particularly ring (30), allows melted sealant material to flow under and around bridging means (24) to form a confined seal between wall (21), wall (22) and an annular surface (29) on the circuit board surrounding cap wall (21).</p> |
申请公布号 |
CA1201213(A) |
申请公布日期 |
1986.02.25 |
申请号 |
CA19840449696 |
申请日期 |
1984.03.15 |
申请人 |
PRINTED CIRCUITS INTERNATIONAL, INC. |
发明人 |
CHEE, AIK T. (SIMON);KIAT, WEE S. |
分类号 |
H01C1/02;H01L23/02;H01L23/04;H05K5/03;(IPC1-7):H01L23/02;H05K1/18 |
主分类号 |
H01C1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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