| 摘要 |
Printed circuits are made by marking the circuit pattern out on a suitably strong carrier board, made of insulating material, with a wet ink based upon a thermosetting resin, and coating the wet ink with particles of an electrically conductive metal or alloy which are pressed into the surface of the ink before the latter sets hard. The circuit pattern is then partly or completely covered with a layer of an electrically conductive solder in paste form which is subsequently fused to bond it with the inked pattern. Except for connection points, the resulting printed circuit may then be coated with a layer of insulating material.
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