| 摘要 |
PURPOSE:To prevent an abnormal oscillation and the lowering of an output, and to extract a high output by forming a conductive projection electrically connected to a metallic layer for a vessel section and an inner-surface metallized layer for a cover section into a vessel. CONSTITUTION:A metallic layer 2 on which a semiconductor chip is fixed is formed on the internal base of a vessel, and a source terminal S is shaped to the metallic layer 2. A side-surface metallized layer 5 connected to the source terminal S is formed on an outer wall 4 on the side where the source terminal S is shaped. A gate terminal G and a drain terminal D are extracted from outer-wall side surfaces on which there is no side-surface metallized layer 5. An inner- surface metallized layer is shaped onto the whole surface of the inner surface of a cover section 6 so as to be electrically connected to the metallized layer 5 when the cover section 6 is mounted onto a vessel section. A conductive projection 8 electrically connected to the metallic layer 2 for the vessel section and the inner-surface metallized layer for the cover section 6 is shaped in the vessel. |
