| 摘要 |
The invention relates to a structure 10 of conductive wires for mounting an integrated circuit chip in which the conductive wires 12 are held in place by means of a narrow strip of thermoplastic polymer 24 rather than by an adhesive plastic film glued to the wires. The thermoplastic strip provides a firm holding of several wires after having been heated, cast around the wires and having finally been cooled until it solidifies. <IMAGE> |
