| 摘要 |
PURPOSE:To prevent the reduction of yield regarding processing on assembly by forming a lead frame, to which a hole is bored, around a semiconductor chip on a chip-stage on which the chip is fixed. CONSTITUTION:Hole sections 28 are shaped around a chip-stage 21 for a lead frame. A chip 22 is bonded onto the chip-stage 21 for the lead frame plated with Au through a die-bonding means in the chip-stage 21 and a wire bonding region, etc. in the lead frame. Bonding-pads 25 for the chip 22 and nose sections in the internal direction of leads 24 in the lead-frame are connected by Au or Al small- gage wires 23 through the wire-bonding means. |
