摘要 |
PURPOSE:To prevent noise from being introduced, to reduce erroneous operations of a semiconductor device, by stacking a plate-shape capacitor on a die-stage of a lead frame. CONSTITUTION:A capacitor 6 is a plate-shape ceramic capacitor having electrodes on front and back faces respectively, and serves as a noise canceler of which one electrode is secured to the underside of a diestage 3 being connected to a ground terminal, for example with brazing, and the other electrode is connected to a power source terminal by a wire 4a. Since the capacitor 6 is positioned near the chip 1, introduction of noise which may result from long distance between the power source terminal and the ground terminal can be prevented. Moreover, a noise canceler which used to be mounted previously outside the semiconductor device can be eliminated, simplifying a panel structure carrying the semiconductor device. |