| 摘要 |
PURPOSE:To attach plating metal of gold and the like on only necessary parts by covering a lead metal layer with a thin coating layer except surrounding section of die-attach metal layer and soldering section of outer lead terminals. CONSTITUTION:A lead metallic layer 15 is covered with a thin coating layer 20 of ceramic except bonding pad section 15b and outer lead terminal soldering section 15c. So, metal plating on unnecessary section, e.g. middle section of a lead metallic layer 15 and plating metallic layer of surrounding section of a substrate 11, is completely avoided and enable to remarkablly reduce the consumption of expensive plating metal. Furthermore, when the plating metallic layer is removed by gringing machine, electrical short between the adjacent lead metallic layer 15 of narrow width caused by the burr of the lead metallic layer 15 is effectively prevented. |
