| 摘要 |
PURPOSE:To provide a circuit module which can be made in miniature and has a distance between devices being possible to be shortened, by uniting active and passive devices each being a three-dimentional cube with wiring members each being three-dimensional cube, which connect among terminal being provided on respective faces of these cubes. CONSTITUTION:A semiconductor integrated circuit chip 1 is buried in a cubic insulator 12. Terminals 2 on the chip 2 are connectef to chip-side terminals 13 on the cube by thick-film or thin-film wirings 14 on the faces of the chip 1, and moreover are connected to external connecting terminals by multi-layer wiring 15. The multi-layer wirings 15 directly connecting among the external connecting terminals are employed to form wiring buses by combining them with the other cubic devices or cubic wiring members. The three-dimentional cubic active devices 17 and the wiring members 18 are stacked, considering the connections among them, and are connected by planar connectors 20 and are connected to the outside by external connecting modules 21. |
