| 摘要 |
An improved semiconductor heat sink for securing a semiconductor thereto for dissipating the heat generated by the semiconductor as well as for supporting those circuit board components which extend upwardly from the circuit board adjacent to the heat sink comprises a vertically extending leg fastened at its lower end to a printed circuit board. The leg has at least one mounting surface thereon for receiving a semiconductor in face to face relationship therewith. Extending outwardly from the leg in opposite directions are a pair of fins, each fin being perpendicular to the mounting surface on the leg. Running along the end of each fin is a downwardly extending projection for engaging a complementary groove in a separate one of a pair of circuit board components, such as connector blocks which each extend upwardly from the circuit board adjacent to a separate one of the fins so that the edges serve to impart further rigidity to the connector blocks.
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