| 摘要 |
PURPOSE:To accommodate semiconductor substrates without blowing the air from the recessed part for accommodation at the time of accommodating semiconductor substrate by providing a through hole to the recessed part for accommodating semiconductor substrate. CONSTITUTION:A through hole 21 is provided to the recessed part 14 for accommodating semiconductor substrate 23 of a support 13. Thereby, the air which is held between the recessed part 14 and semiconductor substrate 13 at the time of accommodating substrate 23 to the recessed part 14 can be escaped through the hole 21. Therefore, dust at the recessed part does not blow up and is not adhered to the other semiconductor substrate and yield of the products can be improved. Moreover, since the semiconductor substrate 23 can be lifted by inserting a lifting member into the through hole 21, the external circumference of semiconductor substrate can be carried in or carried out while it is being held with an automatic carrying apparatus. Accordingly, any damage is not inflicted on the surface of the semiconductor substrate. |
