| 摘要 |
PURPOSE:To provide a device having a excellent heat-dissipation characteristic, by putting a circuit element on an electrical-insulating substrate containing a principle ingredient of aluminiun nitride. CONSTITUTION:Circuit elements such as a semiconductor device 3, a cermet resistor 4 and a capacitor chip 5 are secured on a conductive wiring 2 made of silver paste being formed on the principal face of an aluminum nitride insulating substrate 1. The insulating substrate in which at least one of acetylide compounds of calcium carbide, strontium carbide and barium carbide is added by 0.02-10wt% in their total and is sintered, can be practically employed and can absorb heat quantity resulted from circuit elements at an efficiency 4-8 times that of alumina owing to the excellent heat conductivity to dissipate the heat. |
