| 摘要 |
PURPOSE:To form easily a winding window without damaging a magnetic thin film by providing an unpierced hole on the front surface side of a nonmagnetic substrate, and cutting a specified part from the rear surface side to convert the unpierced hole into the winding window. CONSTITUTION:An unpierced hole 6 is formed in 20-300mum deepness on the front surface 1a side of a wafery nonmagnetic substrate 1 by ultrasonic machining, etc. A hole 4' is formed thereon by sputtering, and a magnetic film 21 is formed by sputtering. A nonmagnetic spacer 3 and a magnetic film 22 are further formed, and then the unpierced part is cut from the rear surface 1b of the substrate 1 with a dicer, etc. to form a through-hole which is used as the winding window 4. Winding is applied to the window to form a magnetic head. Consequently, the winding window can be easily formed without damaging the magnetic thin film 2 and without deteriorating the magnetic characteristic. |
