Method of forming an insulating film on a semiconductor body.

摘要

The present invention relates to a method of manufacturing a semiconductor integrated circuit wherein a thin film such as insulator film is formed on selected areas of a semiconductor substrate. According to the present invention, photoresist is provided on selected areas of the semiconductor substrate in advance. The semiconductor substrate is placed in a reactor, and raw material gases for the thin film are caused to flow through the reactor, to form the thin film in accordance with chemical vapor deposition utilizing a photochemical reaction and to simultaneously decompose the photoresist owing to a photochemical reaction. Thus, the thin film is deposited on the parts other than the photoresist.