发明名称 |
Soldering apparatus |
摘要 |
An apparatus for automatically coating terminal leads of electrical components such as IC with solder for improving solderability thereof. A plurality of IC stored in a row within a container placed at a predetermined feed location are automatically fed onto a track extending adjacent to a series of work stations arranged in a straight path and including a soldering station in which IC are contacted with a solder wave. Driving means is provided for displacing along the track the row of IC fed thereon. The worked IC are automatically collected within an empty container placed at a predetermined receipt location.
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申请公布号 |
US4570569(A) |
申请公布日期 |
1986.02.18 |
申请号 |
US19840670941 |
申请日期 |
1984.11.13 |
申请人 |
NIHON DEN-NETSU KEIKI CO., LTD. |
发明人 |
KONDO, KENSHI |
分类号 |
B23K1/08;B23K3/06;H01L21/677;(IPC1-7):B05C3/02 |
主分类号 |
B23K1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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