| 摘要 |
<p>A heat exchange attachment device (10) for integrated circuits (30) which eliminates any need for contact with adhesive pastes or solder. A snap-on holding piece (20) permits a finned cooling unit (12) to be threaded through an aluminum base plate (25) attached to the pin grid array package (30) so that a threaded shaft (12t) of the cooling unit may be screwed into adjustable contact with a berylium oxide disk (30d) mounted on the integrated circuit package.</p> |
