| 摘要 |
PURPOSE:To attain to enhance the reliability, capacity and assembling workability of a sensor, by forming electrodes to both terminals of a strain-sensitive resistor in a thin film while forming a solder layer on the conductor circuit between electrodes in a thick film form. CONSTITUTION:Four thin film like strain-sensitive resistors 4, each of which is formed by providing a silicon semiconductor to an insulating layer, are formed on a diaphragm 2 to constitute a bridge circuit (two central strain-sensitive resistors at the center receive tensile force and two strain-sensitive resistors at the terminal parts receiving compression force). The thin film like electrode parts 8 comprising nickel formed to both terminal parts of each strain-sensitive resistor includes the electrodes 8a on each strain-sensitive resistor and the conductor circuit part 8b between the electrodes. The thick film like solder layer 10 formed on the electrodes 8a and the conductor circuit part 8b between the electrodes 8a covers the whole of the electrodes and conductor circuits on the bridge circuit. The diaphragm 2 generates strain by pressure from a liquid introducing port 7 and each strain-sensitive resistor on the diaphragm 2 generates the change in electric resistance caused by strain and this change is taken out to the outside as the change in bridge output voltage through a lead wire 6. |
