发明名称 |
METHOD OF PROVIDING THROUGH HOLE PLATING BETWEEN CIRCUIT ELEMENTS |
摘要 |
<p>METHOD OF PROVIDING THROUGH HOLE PLATING BETWEEN CIRCUIT ELEMENTS of the Invention: A method of providing through-hole plating between flexible circuit elements and rigid circuit elements is presented wherein a strong and reliable electrical connection is affected without damage to the conductive pattern of the flexible circuit elements. The method includes selectively providing removable masking material to portions of a flexible circuit element followed by nonelectrolytic plating and subsequent removal of the mask. An additional resist layer is also provided to selective areas followed by electrolytic plating and subsequent removal of the resist material.</p> |
申请公布号 |
CA1200922(A) |
申请公布日期 |
1986.02.18 |
申请号 |
CA19840450807 |
申请日期 |
1984.03.29 |
申请人 |
NIPPON MEKTRON LTD. |
发明人 |
MATSUMOTO, HIROFUMI |
分类号 |
H05K3/00;H05K3/42;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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