SOLDER ALLOY FOR CONNECTOR JUNCTION

摘要

PURPOSE:To stabilize the contact with the metallic pins of a semiconductor module by using a solder alloy constituted by adding a specific ratio of Au to an In-Sn alloy having a prescribed compounding ratio for the solder alloy to be packed into a connecting tank of a solder melting type high-density connector. CONSTITUTION:The solder alloy formed by adding Au to the In-Sn alloy consisting of 41-93wt% In and the balance Sn at 0.1-19.5wt% by the total weight of said alloy is packed into the connecting tank for the solder melting type high- density connector, by which the packaging of the semiconductor element to a printed board is executed. The contact with the metallic pins of the semiconductor module is thus stabilized and the life of the metallic pins is considerably extended.