| 摘要 |
PURPOSE:To cut a lead wire at uniform length by stable supporting a substrate through a process of engagingly locking/pushing the circumferential edge of the substrate by means of an engagingly locking member supported movably in plane direction on a frame body transported to the cutting tool side, and bringing the retaining tool for the frame body in contact with the surface of substrate. CONSTITUTION:A printed substrate 1 is engagingly locked and supported by locking parts 7a, 5a of a frame member and held by pushing force of a leaf spring 9. In addition, its circumferential edge is supported by a guide pin 15, while the surface of substrate 1 is maintained flat due to contact force of a retaining tool 17 restricting any bend liable to occur on the substrate 1. Both pin 15 and retaining tool 7 are vertically movable and also shiftable on a horizontal plane, accordingly any bend on the substrate can be almost perfectly prevented. Therefore, by moving the frame body toward cutting edge 3 side under this condition, a lead wire 2a can be cut out uniformly. |
