| 摘要 |
<p>PURPOSE:To enable a device to easily and high accurately polish a free curved surface, by providing a polisher position detecting means provided in the end of a vertically free moving spindle, relatively moving means for a workpiece and a polishing pressure regulating means. CONSTITUTION:A device, rotating a polisher 2 so as to generate a flow of a solution 11 mixing an abrasive grain 14 to intrude into a part between the polisher and a workpiece 6 and floating the polisher 2, advances polishing work by collision of the abrasive grain 14 against the workpiece 6. And the polisher 2, if its relative position with the workpiece 6 is fixed, vertically moves causing the workpiece 6 to advance its polishing downward. That is, a polishing quantity is determined by a relative speed between the polisher 2 and the workpiece 6. Here the polisher 2, holding a gap (g) between the polisher 2 and the workpiece 6, rises on a protrusive part 15, if it is provided in workpiece 6, but stops by a sensor 9 detecting a vertical movement, and the device, lowering the polisher 2 to a predetermined position and moving the workpiece 6 to the next polishing, removes the protrusive part.</p> |
