| 发明名称 |
MOUNTING STRUCTURE OF FLAT LEAD PACKAGE TYPE ELECTRONIC PART |
| 摘要 |
<p>A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilted inward by a desired angle with respect to the normal of the plane.</p> |
| 申请公布号 |
JPS6132490(A) |
申请公布日期 |
1986.02.15 |
| 申请号 |
JP19840153403 |
申请日期 |
1984.07.24 |
| 申请人 |
FUJITSU LTD |
发明人 |
YAMAMOTO TAKESHI;OKADA NOBUHIDE;KAWAMURA YASUO |
| 分类号 |
H05K1/18;H01L21/48;H01L23/50;H05K1/02;H05K3/30;H05K3/34 |
主分类号 |
H05K1/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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