MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To fill the gap between a pellet and a cap closely with resin preventing the resin upon the pellet surface from thinning down by a method wherein an upright semiconductor with its cap implanted with resin is heated and then cooled down to solidify the resin. CONSTITUTION:A semiconductor device 1 is placed with an opening 11 of a dam 9 turned upward to implant the opening 11 with liquid silicon resin 13. Next the semiconductor is heated as it is upright. Then the silicon 13 is cooled down to room temperature and an aluminum cap 14 is bonded on the opening 11 likewise the dam 9 is bonded to a plastic substrate 2 using silicon base adhesive 10a to complete the device. At this time, the silicon 13 is solidified into hard jelly state so that the silicon 13 may not be fluidized within the cavity even if the semiconductor 1 is laid sideways.