| 摘要 |
<p>PURPOSE:To omit both inner lead bonding and outer lead cutting processes by a method wherein leads arranged together with wirings on a substrate are overhung above a semiconductor element containing hole to bond the edges thereof on a chip by means of solder reflowing process. CONSTITUTION:The edges 5 of conductor leads 4 arranged on a substrate 1 are overhung as cantilevers above a containing hole 3 of a chip 2 concavely provided in almost central part of a semiconductor mounting substrate 1. Besides, the conductor leads 4 formed of thin layers including the lead edges 5 thereof are covered with insulating layers 7 for the sake of reinforcement. Finally the chip 2 formed of solder bumps 6 may be brought into contact with the edges 5 of conductor leads 4 to be bonded with one another by means of solder reflowing process.</p> |
