| 摘要 |
A plastic-mold cutting apparatus using supersonic waves, equipped with a horn allowed to vibrate by supersonic waves from a supersonic oscillator, applies its horn on a plastic mold to cut the plastic mold at a prescribed position by use of the vibrational energy of the horn. An oscillating mechanism containing the supersonic oscillator and horn is provided stationary. A pressing element for pressing the mold placed on the horn is provided so as to be capable of moving in the direction toward the horn. The structure that the pressing element possible to be of light weight is designed to move, leads to decrease in size and weight of the apparatus and to establishment of an excellent oscillating system.
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