| 摘要 |
PURPOSE:To unnecessitate the space on a substrate for mounting a capacitor by a method wherein a capacitor set at a required capacitance is formed integrally with the package. CONSTITUTION:The capacitor is formed integrally with the package. For example, using a film capacitor as the capacitor 20, this is stuck to the upper surface of the package 13. In the manufacture of the titled device, conductor wirings 31 and 32 electrically connected to a conductor terminal 12a to serve as the supply terminal and a conductor terminal 12i to serve as the ground terminal at points P1 and P2 respectively are previously provided in a package 13; at the time of sticking the capacitor 20 which is a film capacitor to the upper surface of this package 13, the electrode 21 and 22 of said capacitor 20 are electrically connected to these conductor wirings 31 and 32 through points P3 and P4 respectively. |
