| 摘要 |
The present invention relates to an interconnection method allowing connection of the contact blocks 5, 6 of two integrated circuits 1, 2 mounted side by side on a support 3 or the contact blocks of an integrated circuit and those of the casing containing it. According to this method: - a circuit of connections comprising on a passive substrate 11 at least one connection network 10 with contact blocks corresponding to the contact blocks to be interconnected is produced; - at least one series of contact blocks is fitted with indium needles 13, 14; and - the connection circuit is pressed onto the contact blocks to be interconnected, the interconnection being produced by the indium needles. Application in particular to connecting an infrared detector to its read-out circuit. <IMAGE>
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