| 摘要 |
PURPOSE:To avoid deterioration of a through hole dimensional accuracy by a method wherein a wiring open area is located other area than a through hole of a lower layer wiring when a lower layer wiring pattern having min. wire's width is connected to an upper layer wiring pattern having wider wire width by boring a through hole in an interlayer insulating film covering the lower layer wiring pattern. CONSTITUTION:A lower wiring pattern 1, 1', which has a prescribed pattern having min. wire's width, is formed on a substrate 8 and the whole surface including the above pattern 1, 1' is covered with an interlayer insulating film 7 consisting of polyimide resist and the like. Wiring open area 4', where no pattern is existed, is provided around the connected lower layer wiring pattern 1, 1' under a through hole 3 when the through hole 3, whose purpose is to connect the lower wiring pattern 1, 1' to an upper wiring pattern 2 having wider wiring formed thereon is bored in the insulating film 7 by illuminating ultraviolet ray. Thus, diffused reflection of the ultraviolet ray does not come around on the unexposed area and the dimensional accuracy of the through hole 3 remarkably increased. |
