| 摘要 |
PURPOSE:To make a roughed-surface body by copper electrolytic plating of copper foil preventing a drill from sideslipping, removable in an easy manner, by applying the roughed-surface body made, whose copper foil surface is subjected to copper electrolytic plating, to a drilling position alone. CONSTITUTION:A sensitive photo-resist film is coated or stuck on the copper foil of a printed circuit board being subject to copper electrolytic plating, and such a photo-mask as securing an open line of 1mm. square at an intersection point of a reference grid superposed, exposed and developed. After all intersec tion points or intersection positions to be drilled are opened, a photo-resist film as a plating resist is plated with a copper overcurrent, peeling the photo- resist, thus the PCB to be drilled is produced. Here, the PCB secures an electro lytic plating part 9 having an accular projection of copper of about 10mum per about 1mm<2> at the position, to be drilled, of the intersection point of a reference grid 8. After drilling, a copper plating part to be left behind for the next process is physically polished and removed. |
