| 摘要 |
PURPOSE:To obtain a high dampproof semiconductor device by a method wherein a projected part is formed surrounding a concave part of a package, in which a semiconductor chip is installed, a seal ring with rough back surface is adhered to the projected part, then this surface is covered with a lid. CONSTITUTION:A concave part is formed on a lower half of a package main body 12 made by thermosetting resin, a semiconductor chip 3 is adhered on the base 9a through a die-pad 11, a lead frame 9 is adhered on a convex lower half of the main body 12 and a lead 10 and an electrode of the chip 3 is connected through a bonding wire 4. Then a metal seal ring 13 with rough back surface is adhered on a lower half of the main body 12 in such a manner as to surround the chip 3, and a lid 14 is adhered to the ring 13 surface with a wax 15 to cover a chip accommodation concave part 6 created by the above-mentioned process. Thus, the package main body 12 will not be injured because of the sum effect when the wax 15 is molten. |
