| 摘要 |
PURPOSE:To make a hybrid IC compact easily, by providing with an opening for housing a mounting electronic part through at least one of a land of a lead frame and a wiring substrate secured on the land. CONSTITUTION:An opening 15 is formed through a given position on a land 14 of a lead frame 13. On the land 14, a wiring substrate 18 is secured, in which wiring patterns 21, 22 are formed on the surface of an insulating substrate 20 and on the back face being exposed through the opening 15 in the land 14. A plural of IC pellets 25 are mounted at the desired positions of a pattern 21 on the substrate 20 surface, and a mounting electronic part, for example a large capacity chip 26, is mounted so as to be housed in the opening 15 in the land. Thereafter, a main section containing the pellets 25 and the chip 26 is molded with exterior resin 28. When a hybrid IC having a large capacitance, a large resistance and a large inductance is formed in this way, to make the hybrid IC compact can be realized easily. |
