| 摘要 |
PURPOSE:To obtain a large-scale integrated circuit having high integration in high yield by forming collapsibly from externally wirings between a special function block and other function block in the midway and providing external connection electrodes. CONSTITUTION:The entire electronic circuit is divided into a plurality of function blocks 2 and formed on a large-sized semiconductor substrate 1. The mutual connection of the blocks 2 is achieved by aluminum wirings 3, 6. A repairing electrode 7 is led to the surface from the wirings 3, 6 to be readily collapsed by a laser beam from the exterior in the midway. If an improper block 2a is produced, it is collapsed and cut at the cutting portion 8 by the laser beam, and a small-scale integrated circuit chip 10 having the equivalent function to the block 2a is connected with the electrode 7. |
