| 摘要 |
PURPOSE:To prevent improper connection and disconnection by rubbing a coated wire with the surface of an inner lead at the position different from the bonded portion of the inner lead in case of bonding to remove a coating material. CONSTITUTION:After a coated wire 20 is bonded onto the electrode pad 4 of a pellet 3 in a semiconductor device 1 held on a bonding stage 8, a capillary 18 forms a loop of the wire 20 to move to the position near the pellet of the lead 6. Then, the wire 20 is retained by the capillary 18 to the lead 6, and moved horizontally to the position of the outer lead side. At this time, the retained wire 20 passes a step 7, part of the material 20b is engaged with the step 7, and separated. |
