| 发明名称 |
METHOD OF PRODUCING MULTILAYER CIRCUIT BOARD |
| 摘要 |
A method of fabricating multilayer printed circuit boards using polymer thick film technology is disclosed which utilizes photoimageable dielectric material between conductive polymer thick film layers and which is capable of producing extremely small and uniformly-sized vias. |
| 申请公布号 |
JPS6129195(A) |
申请公布日期 |
1986.02.10 |
| 申请号 |
JP19850141453 |
申请日期 |
1985.06.27 |
| 申请人 |
TEKTRONIX INC |
发明人 |
CHIYAARUSU II BAUAA;UIRIAMU EI BOORUDO |
| 分类号 |
H05K1/09;H05K3/00;H05K3/24;H05K3/34;H05K3/40;H05K3/46 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
