| 摘要 |
PURPOSE:To lower the hardness of copper ball while heat press bonding and to obtain a copper alloy small-gage wire excellent for bonding operation, by a method wherein very small amount of transition element are added to pure copper. CONSTITUTION:As additional elements at most 200ppm are contained in a metal small-gage wire of which main components are copper. Additional elements before mentioned are either of vanadium, manganese and titanium. A copper alloy wire which contains transition elements of 100-200ppm or below makes remarkably reduce the faulty ratio owing to cracks of elements, and will not produce deterioration of the tension strength, and also the fusing phenomenum to a capillary, and becomes excellent material for small-gage wire for bonding. |
