发明名称 ETCHING PROCESS
摘要 <p>PURPOSE:To make it feasible to read dimensional precision of rectangular patterns immediately by a method wherein the first pattern row arranged with rectangular patterns making respective gaps and the second pattern row for inspection are arranged with one side of each rectangular pattern opposing zigzag to each other to be etched so that the gaps may be successively changed conforming to specified dimension. CONSTITUTION:The first and second rows of rectangular patterns are alternately arranged with one side opposing to each other. Then prolongated lines 1y and 2y of longitudinal and parallel sides of adjacent rectangular patterns 4 and 5 are arranged to traverse the opposing two rectangular patterns 4 and 5 assuming their gap to be (w). Likewise, inspecting mask patterns 5 and 7 are formed assuming the gaps between the rectangular patterns 5 and 6, 6 and 7, 7 and 8 respectively to be 2w, 3w, 4w. When the peripheries of patterns are etched and all patterns 4-8 are etched excessively by (w) per one side utilizing such mask patterns 5 and 7, new rectangular patterns 41-81 may be formed respectively out of the former rectangular patterns 4-8.</p>
申请公布号 JPS6127632(A) 申请公布日期 1986.02.07
申请号 JP19840148967 申请日期 1984.07.17
申请人 MATSUSHITA ELECTRONICS CORP 发明人 TAKANORI TAKESHI
分类号 C23F1/00;G03F1/84;H01L21/302;H01L21/306 主分类号 C23F1/00
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