| 摘要 |
PURPOSE:To make two wafers in a body and to enable high density installment, by a method wherein mutual communication between wafers is carried out utilizing light communication. CONSTITUTION:The output of an integrated circuit 1a of a wafer 1 is applied to an integrated circuit 4a of a wafer 4 through the intermediary of an electricity- light conversion circuit 2a, a light channel 7a and a light-electricity conversion circuit 3b, and the output of the integrated circuit 4a of a wafer 4 is applied to an integrated circuit 1a of the wafer 1 through the intermediary of an electricity-light conversion circuit 2b, a light channel 7b and a light-electricity conversion circuit 3a. The input and output between integrated circuits 1a, 4a and outside are carried by wires 6. As for light masking material 8, such as gum having a shock absorbing function and an electric insulating function is desirable. |
