| 摘要 |
PURPOSE:To reduce the manufacturing cost by eliminating a process for connecting and securing lead terminals by a method wherein a conductive thin plate is formed to include lead terminals and a conductive pattern is formed on a covering composed of insulating material on top of the substrate. CONSTITUTION:Exposure is accomplished with a conductive thin plate 1 made of iron, cupper or phosphor bronze serving as a mask, to be follwed by etching for the formation of lead terminals 2, 3. An insulating layer 4 is formed by application of screen-printing of a high-polymer conductive material, and then a lead frame 8 is cut away. A pattern 5 and soldering paste 6 are formed by printing, both sides of the thin plate 1 are bent into a form like a DIP, for the formation of a metal-core wiring substrate. An electric device 9 is connected to the metal- core wiring substrate, the entirety is molded in a molding material 10 of plastics or the like, for the completion of a DIP-type hybrid IC. |
