| 摘要 |
PURPOSE:To decrease the warp and distortion of a resin substrate caused by the contraction of a resin film after the connection to the substrate by forming chamfering or roundness on the recording layer side of the ring projecting part of a sealer for fusion. CONSTITUTION:The chamfering or roundness is formed on the edge part of a wall at least on the recording layer side of ring projecting parts 21 and 25 of sealers 19 and 24 for the thermal fusion. Further, a flexible resin film 12 is superposed on the surface of the recording layer 16 side of a resin substrate 11, and it is arranged between the sealer 19 of a thermal fusing machine 18 and a receiving jig 20. Next, the projecting part 21 of the heated sealer 19 is pressed on a film 12 at a position corresponding to a non-recording area 14 on the internal peripheral side of the substrate 11, and they are fused and coupled. Next, the same coupling is executed in the non-recording area 15 on a external peripheral part by a thermal fusing machine 23 in the same way. Thus, the contraction of the film is not practically generated, and the warp and distortion of the substrate 11 are decreased. |
