| 摘要 |
<p>PURPOSE:To obtain a chip resistor having excellent solderability by using a ruthenium based thick film resistor which is overlapped on a part of an upper surface electrode layer as a resistor layer, and using a thin film electrode wherein copper that is overlapped on a part of the upper surface electrode is a main component as an end surface electrode layer. CONSTITUTION:A silver based thick film electrode is formed on the base material of an insulating sintered substrate 1 as an upper surface electrode layer 2. A resistor layer 4 comprising a ruthenium based thick film resistor is formed so that the layer is overlapped on a part of the electrode layer 2. A thick film electrode wherein copper that is overlapped on a part of the electrode layer 2 is a main component is formed as an end surface electrode layer 3. Then, the silver based thick film electrode is not eroded with solder at the time of solder dipping without plating. In this way, a chip resistor having excellent solderability is obtained.</p> |
