发明名称 |
Molded electrical device, molded circuit board substrate and molded chip carrier. |
摘要 |
<p>This invention is directed to a molded electrical device comprising an electrically conductive pathway and an insulating material, and capable of interconnecting with external circuitry said insulating material comprising a blend of a particular amorphous polymer and a particular crystalline thermoplastic polymer. Also, this invention is directed to a composition suitable for use as an insulating material in an electrical device comprising from about 35 to about 65 weight percent of an amorphous polymer selected from a polyarylethersulfone resin, a polyarylether resin, a polyetherimide or a polyarylate, and from about 65 to about 35 weight percent of a crystalline polymer selected from a poly(arylene sulfide), a polyester or a polyamide.</p> |
申请公布号 |
EP0170065(A1) |
申请公布日期 |
1986.02.05 |
申请号 |
EP19850108029 |
申请日期 |
1985.06.28 |
申请人 |
UNION CARBIDE CORPORATION |
发明人 |
HARRIS, JAMES ELMER;ROBESON, LLOYD MAHLON;RIMSA, STEPHEN BENEDICT |
分类号 |
H05K1/03;C08L67/00;C08L67/02;C08L71/00;C08L71/08;C08L71/12;C08L77/00;C08L79/08;C08L81/00;C08L81/02;C08L81/06;C08L101/00;H01B3/30;H01B3/42;H01L23/29;H01L23/31;(IPC1-7):H01B3/30;C08L71/04 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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