发明名称 |
Low loss, multilevel silicon circuit board. |
摘要 |
A silicon circuit board incorporates multiple levels of patterned conductors. First level upper and lower patterned conductors are situated on an insulation-coated, monocrystalline silicon substrate. Upper and lower, high resistivity, polycrystalline silicon layers, in turn, are situated on the first level upper and lower patterned conductors, respectively. Second level upper and lower patterned conductors are situated over the upper and lower polycrystalline silicon layers. Further levels of patterned conductors in the circuit board may be provided by iteratively forming on the board polycrystalline silicon layers and patterned conductors. Conducting feedthroughs in the circuit board provide electrical communication between various patterened conductors. |
申请公布号 |
EP0170122(A2) |
申请公布日期 |
1986.02.05 |
申请号 |
EP19850108622 |
申请日期 |
1985.07.10 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
CARLSON, RICHARD OSCAR;GLASCOCK II, HOMER HOPSON;LOUGHRAN, JAMES ANTHONY;WEBSTER, HAROLD FRANK |
分类号 |
H01L23/522;H01L21/70;H01L21/768;H01L23/12;H01L23/14;H01L23/538;H01L27/13;H05K3/46 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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