| 摘要 |
PURPOSE:To mount a semiconductor element as large in external dimension as possible on a small package by a method wherein the semiconductor element is fixed to the rear of an inner lead, and the electrode pad of the semiconductor element is connected to the inner lead with a metal fine wire. CONSTITUTION:A lead frame 1 is provided with an inner lead 2 and an outer lead 3, and the bonding part of the inner lead 2 is plated with Ag. A semiconductor element 4 is made to bear on the underside of the inner lead 2 and bonded to it through a adhesive agent 7 formed of epoxy resin, and the inner lead 2 is so shaped as not to interfere with an electrode pad 5 of the semiconductor element 4. The electrode pad 5 of the semiconductor element 4 is connected to the bonding part of the inner lead 2 with a metal fine wire 6. Furthermore, the part other than the outer lead 3 is sealed up with a resin 8 to constitute a small package. By this setup, a semiconductor element as large in external dimension as possible can be mounted on a small package. |
