| 摘要 |
The invention concerns a process for stripping off pattern boards residual etching or plating resistant material in the form of an alkali-soluble photopolymer, whereby this process is characterised by treating the resistant in a strongly alkaline bath containing a boron and phosphorus compound in a volume of from 0.1 g/litre up to the solubility limit for the compound in question in the actual bath, and 75-125 g/litre of a hydroxide ion source, for sufficient time for the resistant to become brittle, thereafter the resistant can be loosened from the pattern board with a water spray. |
