FLUX FILLING ON SNPB BASE FOR TUBE SOLDERS

摘要

The flux filling of soft tubular solders based on SnPb is intended especially for soldering in the form of a tubular solder in connection with the suitable and common source of light. In the form of a solution, it can be well utilized for soldering e.g. of plates of printed circuits by a fluid wave of solder or for machinery (plumbing) soldering of common materials. The principle of the flux filling lies in the fact that the main component is based on esterified non-ionic fatty alcohol, ethylene oxide in combination with benzoic acid or salicylic acid. It improves flow of solder, has higher thermal stability, broader use, and it is non-toxic for soldering.