| 摘要 |
PURPOSE:To prevent bonding wires and inner leads from shortcircuiting by a method wherein an insulating film is bonded onto the part of the inner leads wherein the bonding wires are intersected with the other inner leads. CONSTITUTION:An insulating film 2 is bonded onto the rear surfaces of inner leads 3 through the intermediary of an epoxy base bonding agent 9 while a semiconductor chip 1 is bonded onto the rear surface of the insulating film 2 by said bonding agent 9. Next, a pad electrode 5 on the semiconductor chip 1 is electrically connected to the inner leads 3 by bonding wires 4. Next, another insulating film 8 for preventing shortcircuit is bonded onto the part of the inner leads 3 wherein the bonding wires 4 are intersected with the other inner leads 3. Thus, even if the sagging of the bonding wires 4 occurs, the bonding wires 4 and the inner leads 3 are prevented from shortcircuiting. |
