| 摘要 |
PURPOSE:To shorten the molding time by means of controlling the resin amount flowing into the resin sealing part by a method wherein a gate separating a runner of resin sealing metallic mold from the resin sealing part of semiconductor device is made to be opened and closed freely. CONSTITUTION:When a leadframe 2 is inserted into metallic mold 1 to mold sealing resin 3, block 7, 7' are retracted for widening the opening space of gate 4 not to obstruct the path of flowing resin. Immediately after completion of the resin molding process, the block 7, 7' may be inserted into the metallic mold 1 to narrow the opening space of gate 4 just like holding the leadframe 2 between the blocks 7, 7' so that a runner 5 and a resin sealing part 6 may be separated from each other. |
