发明名称 ROOM TEMPERATURE CURING COMPOSITION
摘要 PURPOSE:The titled composition which is moisture-curing, non-tracky after being cured and suitable as a sealant, prepared by incorporating an organosilicon polymer containing specified hydrolyzable groups into a polyether containing moisture- curing silicon groups. CONSTITUTION:0.01-20pts.wt. organosilicon polymer (of a degree of polymerization of 2-50,000) which consists of repeating units of formula I (where R<1> and R<2> each are H or an organic group of 1-12C) and contains hydrolyzable groups (except hydride and hydroxyl groups; e.g. halogen groups, alkoxy groups or amide groups) is incorporated into 99.99pts.wt. polyether which has a main chain consisting of repeating units of (A)-R-O- (where R is a divalent alkylene), contains one or more hydrolyzable silicon groups, and has a molecular weight of 500-150,000 (e.g. polypropylene oxide containing terminal groups of formula II).
申请公布号 JPS6123643(A) 申请公布日期 1986.02.01
申请号 JP19850138815 申请日期 1985.06.24
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 TANI NOBUTAKA;MITA TETSUO;ISAYAMA KATSUHIKO
分类号 C08L71/02;C08L71/00;C08L83/04 主分类号 C08L71/02
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